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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-01	Effect of dispersant addition during ceria abrasive milling process on light point defect (LPD) formation after shallow trench isolation chemical mechanical polishing (STI-CMP) Kang, Hyun-Goo; Katoh, Takeo; Kim, Dae-Hyung; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.44 No.1-7, pp.L238-L241	DOI
2006-05	Dependence of non-Prestonian behavior of ceria slurry with anionic surfactant on abrasive concentration and size in shallow trench isolation chemical mechanical polishing Kang, Hyun-Goo; Kim, Dae-Hyeong; Katoh, Takeo; Kim, Sung-Jun; Paik, Ungyu; Park, Jea-Gun Japanese Journal of Applied Physics, Vol.45 No.5A, pp.3896-3904	DOI