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Showing results 1 to 60 of 68

Issue Date	Title / Author(s) / Citation	File
1999-02	Low Temperature Chemical Vapor Deposition of (Ba, Sr)TiO3 Thin Films for High Density Dynamic Random Access Memory Capacitors Joo, Jae-Hyun; Park, Jong-Bum; Kim, Younsoo; Lee, Kong-Soo; Lee, Jun-Sik; Roh, Jae-Sung; Kim, Jae Jeong Japanese Journal of Applied Physics 38 (1999) L195-L198	DOI
1999-06	Reduction of Dichlorosilane-Based Tungsten Silicide Resistivity by Amorphization and Its Applicability as an Electrode Byun, Jeong Soo; Lee, Byung Hak; Park, Ji-Soo; Sohn, Dong Kyun; Hong, Jeongeui; Cho, Won-Ju; Choi, Sang Jun; Kim, Jae Jeong Journal of the Electrochemical Society, 146, 2261-2269	view file DOI
2001	Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 40 (2001) 7151-7155	DOI
2001-11	A Study on Thermal Stability of CoSi2 Employing Novel Fine-Grained Polycrystalline Silicon/CoSi2/Si(001) System Bae, Jong-Uk; Sohn, Dong Kyun; Park, Ji-Soo; Han, Chang Hee; Park, Jin Won; Kim, Yeong-Cheol; Kim, Jae Jeong Japanese Journal of Applied Physics 40 (2001) 6307-6310	DOI
2001-12	Optimized Surface Pretreatments for Copper Electroplating Kim, Jae Jeong; Kim, Soo-Kil Applied Surface Science 183 (2001) 311-318	DOI
2002-02	Corrosion in Aluminum Chemical Mechanical Planarization for Sub-Quarter Micron Dynamic Random Access Memory Devices Kim, Jae Jeong; Kim, Jun Yong; Jeong, Chae Ho; Park, Nae Hak; Han, Sang Bum; Park, Jin Won; Lee, Won-Jun Japanese Journal of Applied Physics 41 (2002) 925-929	DOI
2002-04	Surface Roughness Reducing Effect of Iodine Sources (CH3I, C2H5I) on Ru and RuO2 Composite Films Grown by MOCVD Kim, Jae Jeong; Jung, Doo Hwan; Kim, Moon Soo; Kim, Sang Hyun; Yoon, Do Young Thin Solid Films 409 (2002) 28-32	DOI
2002-08	Investigation of Copper Deposition in the Presence of Benzotriazole Kim, Jae Jeong; Kim, Soo-Kil; Bae, Jong-Uk Thin Solid Films 415 (2002) 101-107	DOI
2002-11	Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan Japanese Journal of Applied Physics 41 (2002) L1269-L1271	DOI
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003	Effects of an added iodine source (C2H5I) on Ru Metalorganic Chemical Vapor Deposition Kim, Jae Jeong; Kim, Moon Soo; Yoon, Do Young Chemical Vapor Deposition, 2003, 9(2), 105-109	DOI
2003-01	catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization. Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of Electroanalytical Chemistry 542 (2003) 61-66	DOI
2003-08	Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating Kim, Jae Jeong; Cha, Seung Hwan; Lee, Young-Soo Japanese Journal of Applied Physics 42(2003) L953-L955	DOI
2003-09	A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik Japanese Journal of Applied Physics 42 (2003) L1080–L1082	DOI
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI
2004	Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier Cho, Sung Ki; Kim, Soo-Kil; Han, Hee; Kim, Jae Jeong; Oh, Seung Mo J. Vac. Sci. Technol. B 22, 2649 (2004)	DOI
2004-01	Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor Kwon, Oh Joong; Cha, Seung Hwan; Kim, Jae Jeong Journal of the Electrochemical Society, 151, C127-C132	view file DOI
2004-01	Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 22(1), 180-184	DOI
2004-05	Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition Han, Hee; Kim, Jae Jeong; Yoon, Do Young Journal of Vacuum Science and Technology a Vacuum Surfaces and Films 22(4), 1120-1123	DOI
2004-08	Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C98-C100	view file DOI
2004-08	Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C101-C103	view file DOI
2004-09	Additives for Super-conformal Electroplating of Ag Thin Film for ULSIs Ahn, Eung Jin; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7(10) C118-C120	view file DOI
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-03	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI
2005-04	Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong Journal of The Electrochemical Society 152, C330-C333	view file DOI
2005-05	The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating Cha, Seung Hwan; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (6), C388-C391	view file DOI
2005-05	Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochimica Acta 50 (2005) 3563–3568	DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI
2005-08	Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization Kang, Min Cheol; Kim, Jae Jeong; Moon, Doo-Kyung Japanese Journal of Applied Physics 44(2005) 5949–5952	DOI
2005-09	Bottom up Filling Using Electrical Oxidation on Pattern Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11), C170-C172	view file DOI
2005-09	Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS) Lee, Chang Hwa; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (11) J27-J29	view file DOI
2005-10	Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing Lee, Jong Won; Kang, Min Cheol; Kim, Jae Jeong Journal of The Electrochemical Society, 152 (12), C827-C831	view file DOI
2005-11	A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong Japanese Journal of Applied Physics 44 (2005) 8107-8109	DOI
2005-12	Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition Kim, Soo-Kil; Hwang, Soonsik; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 9 (2), C25-C28	view file DOI
2006	Hydrogen production by auto-thermal reforming of ethanol over Ni/ -Al2O3 catalysts: Effect of second metal addition Youn, Min Hye; Seo, Jeong Gil; Kim, Pil; Kim, Jae Jeong; Lee, Ho-In; Song, In Kyu Journal of Power Sources 162 (2006) 1270–1274	DOI
2006-06	Electrochemical porosimetry: Deconvolution of distribution functions Song, Hyun-Kon; Jang, Jong H.; Kim, Jae Jeong; Oh, Seung M. Electrochem. Commun. 8 (2006) 1191	DOI
2006-06	Electrochemical porosimetry: Deconvolution of distribution functions Song, Hyun-Kon; Jang, Jong H; Kim, Jae Jeong; Oh, Seung M Electrochemistry Communications, 8 (2006) 1191–1196	DOI
2006-07	Cu Electroless Deposition onto Ta substrates-Application to Create a Seed Layer for Cu Electrodeposition Lee, Chang Hwa; Hwang, Soonsik; Kim, Sang-Chul; Kim, Jae Jeong Electrochemical and Solid state Letters, 9(10), C157-C160	view file DOI
2006-09	Leveling with Step Potential in Damascene Cu Electrodeposition Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 153(12), C822-C825	view file DOI
2006-10	Development of a miniaturized polymer electrolyte membrane fuel cell with silicon separators Kim, Jun-Yeop; Kwon, Oh Joong; Hwang, Sun-Mi; Kang, Moo Seong; Kim, Jae Jeong Journal of Power Sources, 161 (2006) 432–436	DOI
2006-12	Copper Bottom-Up Filling by Electroplating Without any Additives on Patterned Wafer Cha, Seung Hwan; Kim, Seung-Soo; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 10(2), D22-D24	view file DOI
2007	H2O-controlled synthesis of TiO2 with nanosized channel structure through in situ esterification and its application to photocatalytic oxidation Oh, Song-Taek; Choi, Jae-Suk; Lee, Han-Su; Lu, Lianhai; Kwon, Heock-Hoi; Song, In Kyu; Kim, Jae Jeong; Lee, Ho-In Journal of Molecular Catalysis A: Chemical 267 (2007) 112–119	DOI
2007-01	Method of catalyst coating in micro-reactors for methanol steam reforming Hwang, Sun-Mi; Kwon, Oh Joong; Kim, Jae Jeong Applied Catalyst A 316 (2007) 83–89	DOI
2007-02	Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates Lee, Chang Hwa; Cha, Seung Hwan; Kim, Ae Rim; Hong, Ji-Ho; Kim, Jae Jeong Journal of the Electrochemical Society, 154(3), D182-D187	view file DOI
2007-02	Performance of a Miniaturized Silicon Reformer-PrOx-Fuel Cell System Kwon, Oh Joong; Hwang, Sun-Mi; Chae, Je Hyun; Kang, Moo Seong; Kim, Jae Jeong Journal of Power Sources 165 (2007) 342–346	DOI
2007-04	H2O-controlled synthesis of TiO2 with nanosized channel structure through in situ esterification and its application to photocatalytic oxidation Oh, Song-Taek; Choi, Jae-Suk; Lee, Han-Su; Lu, Lianhai; Kwon, Heock-Hoi; Song, In Kyu; Kim, Jae Jeong; Lee, Ho-In Journal of Molecular Catalysis A: Chemical 267 (2007) 112–119	DOI
2007-08	Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects Cho, Sung-Ki; Lee, Jong Kyun; Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 10(10), D116-D119	view file DOI
2007-09	A Silicon-Based Miniaturized Reformer for High Power Electric Devices Kwon, Oh Joong; Hwang, Sun-Mi; Song, In Kyu; Lee, Ho-In; Kim, Jae Jeong Chemical Engineering Journal 133 (2007) 157–163	DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2007-12	Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing Kang, Min Cheol; Nam, Ho-Seong; Won, Ho Youn; Jeong, Sukhoon; Jeong, Haedo; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(2), H32-H35	view file DOI
2008	Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel–alumina xerogel catalysts: Effect of nickel content Seo, Jeong Gil; Youn, Min Hye; Lee, Ho-In; Kim, Jae Jeong; Yang, Eunsun; Chung, Jin Suk; Kim, Pil; Song, In Kyu Chemical Engineering Journal 141 (2008) 298–304	DOI
2008-01	Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 155(3), D176-D180	view file DOI
2008-02	Large-scale synthesis of water dispersible ceria nanocrystals by a simple sol-gel process and their use as a chemical mechanical planarization slurry Yu, Taekyung; Park, Yong Il; Kang, Min-Cheol; Joo, Jin; Park, Jin Kyung; Won, Ho Youn; Kim, Jae Jeong; Hyeon, Taeghwan European Journal of Inorganic Chemistry No.6, pp.855-858	DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-04	The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong Thin Solid Films 516 (2008) 3761–3766	DOI
2008-07	Silicon-based miniaturized reformer with methanol catalytic burner Kwon, Oh Joong; Yoon, Duk Hyoung; Kim, Jae Jeong Chemical Engineering Journal, 140 (2008) 466–472	DOI
2008-07	Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 155(9), D558-D562	view file DOI
2009-01	Silicon-based micro-reactor for preferential CO oxidation Hwang, Sun-Mi; Kwon, Oh Joong; Ahn, Sang Hyun; Kim, Jae Jeong Chemical Engineering Journal 146 (2009) 105–111	DOI
2009-02	A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Cho, Sung Ki; Lim, Taeho; Lee, Hong-Kee; Kim, Jae Jeong Journal of The Electrochemical Society, 157(4), D187-D192	view file DOI

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