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Showing results 1 to 18 of 18

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2001-12	Optimized Surface Pretreatments for Copper Electroplating Kim, Jae Jeong; Kim, Soo-Kil Applied Surface Science 183 (2001) 311-318	DOI
2002-08	Investigation of Copper Deposition in the Presence of Benzotriazole Kim, Jae Jeong; Kim, Soo-Kil; Bae, Jong-Uk Thin Solid Films 415 (2002) 101-107	DOI
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2002-12	Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38	DOI
2003-01	catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization. Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of Electroanalytical Chemistry 542 (2003) 61-66	DOI
2003-09	A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Young Shik Japanese Journal of Applied Physics 42 (2003) L1080–L1082	DOI
2003-12	Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation Kim, Jae Jeong; Kim, Soo-Kil; Kim, Yong Shik Journal of the Electrochemical Society, 151, C97-C101	view file DOI
2004	Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru thin film barrier Cho, Sung Ki; Kim, Soo-Kil; Han, Hee; Kim, Jae Jeong; Oh, Seung Mo J. Vac. Sci. Technol. B 22, 2649 (2004)	DOI
2004-08	Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C98-C100	view file DOI
2004-08	Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C101-C103	view file DOI
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-04	Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong Journal of The Electrochemical Society 152, C330-C333	view file DOI
2005-11	A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea Kang, Moo Sung; Kim, Soo-Kil; Kim, Jae Jeong Japanese Journal of Applied Physics 44 (2005) 8107-8109	DOI
2005-12	Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition Kim, Soo-Kil; Hwang, Soonsik; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-State Letters, 9 (2), C25-C28	view file DOI
2007-08	Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects Cho, Sung-Ki; Lee, Jong Kyun; Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 10(10), D116-D119	view file DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-04	The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong Thin Solid Films 516 (2008) 3761–3766	DOI

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