Publications
Detailed Information
Microstructure and electrical properties of damascene Cu and inkjet-printed Ag interconnects : 다마신 Cu 배선과 잉크젯 프린트된 Ag 배선의 미세조직과 전기적 비저항에 관한 연구
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 주영창
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- 미세조직 ; microstructure ; 전기적 비저항 ; electrical resistivity ; 나노입자 ; nanoparticles ; 다마신 Cu ; damascene copper ; 잉크젯 Ag ; inkjet-printed silver
- Description
- Thesis(doctor`s)--서울대학교 대학원 :재료공학부,2007.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045079
https://hdl.handle.net/10371/13587
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.