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차세대 반도체 배선용 Cu(Mg) 박막의 미세구조와 전기적 특성 및 알루미늄 배선의 응력 평가 : Microstructural and electrical properties of Cu(Mg) thin films and stress evaluation of aluminum lines for ULSI interconnects
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- Authors
- Advisor
- 주영창
- Issue Date
- 2005
- Publisher
- 서울대학교 대학원
- Keywords
- 구리 ; Cu(Mg) ; 알루미늄 ; MgO ; 스트레스 ; Reliability ; 신뢰성 ; TDDB ; Al ; Stress induced voiding
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2005.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000051033
https://hdl.handle.net/10371/14323
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