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무전해 도금법을 이용한 UBM 니켈 도금층에 관한 연구
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- Authors
- Advisor
- 강탁
- Issue Date
- 2004
- Publisher
- 서울대학교 대학원
- Keywords
- Zincate ; Electroless ni ; Ubm(under bump metallization) ; Flip chip
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2004.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000053842
https://hdl.handle.net/10371/14386
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