Publications
Detailed Information
집적 회로에서 알루미늄, 구리 배선 및 플립칩 SnPb의 electromigration 거동
Cited 0 time in
Web of Science
Cited 0 time in Scopus
- Authors
- Advisor
- 주영창
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Keywords
- 일렉트로마이그레이션(Electromigration) ; Electromigration ; 알루미늄 배선 ; Aluminum interconnects ; 구리 배선 ; Copper interconnects ; 공융 조성 SnPb 솔더 ; Eutectic SnPb solder
- Description
- 학위논문(석사)--서울대학교 대학원 :재료공학부,2003.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058028
https://hdl.handle.net/10371/14667
- Files in This Item:
- There are no files associated with this item.
Item View & Download Count
Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.