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SnPb계 및 SnAg계 플립칩 솔더의 electromigration 특성 평가

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Authors
최재영
Advisor
주영창
Issue Date
2003
Publisher
서울대학교 대학원
Keywords
ElectromigrationElectromigration플립칩 솔더 범프Flip chip solder bump활성화 에너지Activation energy
Description
학위논문(석사)--서울대학교 대학원 :재료공학부,2003.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000057606

http://hdl.handle.net/10371/14699
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
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