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Sn계 솔더물질의 electromigration 에서 임계전류밀도 분석 : Threshold current density on electromigration of Sn-based solders
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- Authors
- Advisor
- 주영창
- Issue Date
- 2007
- Publisher
- 서울대학교 대학원
- Keywords
- electromigration ; electromigration ; SnAgCu ; SnAgCu ; 공융조성 SnPb ; eutectic SnPb ; Blech product ; Blech product ; 임계전류밀도 ; threshold current density
- Description
- 학위논문(석사) --서울대학교 대학원 :재료공학부,2007.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000043702
https://hdl.handle.net/10371/15063
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