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열 저항을 감소시킨 InGaP/GaAs HBT 소자의 열 특성 성능 향상에 관한 연구 : A study on improvement in Thermal Performance of InGaP/GaAs HBT Device by Reducing Thermal Resistance
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- Authors
- Advisor
- 권영우
- Major
- 전기. 컴퓨터공학부
- Issue Date
- 2011-02
- Publisher
- 서울대학교 대학원
- Keywords
- 전력 소자 ; 열 저항 ; Heat spreading ; 열 시뮬레이션 ; QFI ; GMSK ; 로드풀 ; High power device ; Thermal resistance ; Thermal simulation ; Loadpull
- Description
- 학위논문 (석사)-- 서울대학교 대학원 : 전기. 컴퓨터공학부, 2011.2. 권영우.
- Language
- kor
- URI
- https://hdl.handle.net/10371/159546
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000029866
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