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Numerical simulation of stretchable and foldable silicon integrated circuits

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Authors
Liu, Zhuangjian; Zhang, Yongwei; Song, Jizhou; Kim, Dae-Hyeong; Huang, Yonggang; Rogers, John A.
Issue Date
2009-12
Citation
Advanced Materials Research, Vol.74, pp.197-200
Keywords
BucklingFinite element analysisFlexible electronicsStretchable electronics
Abstract
This paper presents numerical simulation strategies for stretchable silicon integrated circuits that use stiff thin film on elastomeric substrates. Detailed numerical simulation studies reveal the key underlying aspects of these systems. The results indicate, as an example, optimized mechanics and materials for circuits that exhibit maximum principal strains less than 0.2% even for applied strains of up to ∼90%. Simple circuits, including CMOS inverters provide an example that validates these designs. The results suggest practical routes to high performance electronics with linear elastic responses to large strain deformations, suitable for diverse applications that are not readily addressed with conventional wafer-based technologies. © (2009) Trans Tech Publications.
ISSN
1022-6680
URI
http://hdl.handle.net/10371/164285
DOI
https://doi.org/10.4028/www.scientific.net/AMR.74.197
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Others_화학생물공학부
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