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An analytical model of strain isolation for stretchable and flexible electronics

Cited 34 time in Web of Science Cited 32 time in Scopus
Authors
Cheng, Huanyu; Wu, Jian; Li, Ming; Kim, Dae-Hyeong; Kim, Yun-Soung; Huang, Yonggang; Kang, Zhan; Hwang, Keh-Chih; Rogers, John A.
Issue Date
2011-02
Citation
Applied Physics Letters, Vol.98 No.6, p. 061902
Abstract
One important aspect of stretchable electronics design is to shield the active devices from strains through insertion of a soft layer between devices and substrate. An analytical model is established, which gives linear dependence of strain isolation on the reciprocal of strain-isolation layer thickness, and the reciprocal of device and substrate stiffness. Strain isolation is also linearly proportional to the shear modulus of strain-isolation layer and square of device length. (C) 2011 American Institute of Physics. [doi:10.1063/1.3553020]
ISSN
0003-6951
URI
http://hdl.handle.net/10371/164287
DOI
https://doi.org/10.1063/1.3553020
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
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