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Complementary metal oxide silicon integrated circuits incorporating monolithically integrated stretchable wavy interconnects

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dc.contributor.authorKim, Dae-Hyeong-
dc.contributor.authorChoi, Won Mook-
dc.contributor.authorAhn, Jong-Hyun-
dc.contributor.authorKim, Hoon-Sik-
dc.contributor.authorSong, Jizhou-
dc.contributor.authorHuang, Yonggang-
dc.contributor.authorLiu, Zhuangjian-
dc.contributor.authorLu, Chun-
dc.contributor.authorKoh, Chan Ghee-
dc.contributor.authorRogers, John A.-
dc.date.accessioned2020-02-17T04:32:06Z-
dc.date.available2020-02-17T04:32:06Z-
dc.date.created2018-07-02-
dc.date.issued2008-08-
dc.identifier.citationApplied Physics Letters, Vol.93 No.4, p. 044102-
dc.identifier.issn0003-6951-
dc.identifier.other38439-
dc.identifier.urihttps://hdl.handle.net/10371/164344-
dc.description.abstractStretchable complementary metal oxide silicon circuits consisting of ultrathin active devices mechanically and electrically connected by narrow metal lines and polymer bridging structures are presented. This layout-together with designs that locate the neutral mechanical plane near the critical circuit layers-yields strain independent electrical performance and realistic paths to circuit integration. A typical implementation reduces the strain in the silicon to less than ∼0.04% for applied strains of ∼10%. Mechanical and electrical modeling and experimental characterization reveal the underlying physics of these systems. © 2008 American Institute of Physics.-
dc.language영어-
dc.publisherAmerican Institute of Physics-
dc.titleComplementary metal oxide silicon integrated circuits incorporating monolithically integrated stretchable wavy interconnects-
dc.typeArticle-
dc.identifier.doi10.1063/1.2963364-
dc.citation.journaltitleApplied Physics Letters-
dc.identifier.wosid000258179800138-
dc.identifier.scopusid2-s2.0-49149102963-
dc.citation.number4-
dc.citation.startpage044102-
dc.citation.volume93-
dc.identifier.sci000258179800138-
dc.description.isOpenAccessN-
dc.contributor.affiliatedAuthorKim, Dae-Hyeong-
dc.type.docTypeArticle-
dc.description.journalClass1-
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  • College of Engineering
  • School of Chemical and Biological Engineering
Research Area Materials Science

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