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A strain-isolation design for stretchable electronics

Cited 17 time in Web of Science Cited 18 time in Scopus
Authors
Wu, Jian; Li, Ming; Chen, Wei-Qiu; Kim, Dae-Hyeong; Kim, Yun-Soung; Huang, Yong-Gang; Hwang, Keh-Chih; Kang, Zhan; Rogers, John A.
Issue Date
2010-12
Citation
Acta Mechanica Sinica/Lixue Xuebao, Vol.26 No.6, pp.881-888
Keywords
Strain isolationThin filmSubstrateAdhesiveStretchable electronics
Abstract
Stretchable electronics represents a direction of recent development in next-generation semiconductor devices. Such systems have the potential to offer the performance of conventional wafer-based technologies, but they can be stretched like a rubber band, twisted like a rope, bent over a pencil, and folded like a piece of paper. Isolating the active devices from strains associated with such deformations is an important aspect of design. One strategy involves the shielding of the electronics from deformation of the substrate through insertion of a compliant adhesive layer. This paper establishes a simple, analytical model and validates the results by the finite element method. The results show that a relatively thick, compliant adhesive is effective to reduce the strain in the electronics, as is a relatively short film.
ISSN
0567-7718
URI
http://hdl.handle.net/10371/164354
DOI
https://doi.org/10.1007/s10409-010-0384-x
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
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