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Materials and Fabrication Processes for Transient and Bioresorbable High-Performance Electronics

Cited 145 time in Web of Science Cited 153 time in Scopus
Authors
Hwang, Suk-Won; Kim, Dae-Hyeong; Tao, Hu; Kim, Tae-il; Kim, Stanley; Yu, Ki Jun; Panilaitis, Bruce; Jeong, Jae-Woong; Song, Jun-Kyul; Omenetto, Fiorenzo G.; Rogers, John. A.
Issue Date
2013-09
Citation
Advanced Functional Materials, Vol.23 No.33, pp.4087-4093
Keywords
transient electronicsfully formed electronic devicesbioresorbable electronicsbiocompatible electronics
Abstract
Materials and fabrication procedures are described for bioresorbable transistors and simple integrated circuits, in which the key processing steps occur on silicon wafer substrates, in schemes compatible with methods used in conventional microelectronics. The approach relies on an unusual type of silicon on insulator wafer to yield devices that exploit ultrathin sheets of monocrystalline silicon for the semiconductor, thin films of magnesium for the electrodes and interconnects, silicon dioxide and magnesium oxide for the dielectrics, and silk for the substrates. A range of component examples with detailed measurements of their electrical characteristics and dissolution properties illustrate the capabilities. In vivo toxicity tests demonstrate biocompatibility in sub-dermal implants. The results have significance for broad classes of water-soluble, transient electronic devices.
ISSN
1616-301X
URI
http://hdl.handle.net/10371/164372
DOI
https://doi.org/10.1002/adfm.201300127
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Chemical Convergence for Energy and Environment (에너지환경 화학융합기술전공)Journal Papers (저널논문_에너지환경 화학융합기술전공)
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