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Stress and microstructure of damascene Cu interconnects : 반도체용 구리배선의 미세구조 및 응력에 관한 연구
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- Authors
- Advisor
- 주영창
- Issue Date
- 2006
- Publisher
- 서울대학교 대학원
- Keywords
- 다마신 구리배선 ; damascene copper ; 저유전물질 ; low-k dielectric ; 미세구조 ; microstructure ; 응력 ; stress ; 스트레스 보이딩 ; stress-induced failure ; x-ray diffraction ; x-ray diffraction
- Description
- Thesis(doctor`s)--서울대학교 대학원 :재료공학부,2006.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000048707
https://hdl.handle.net/10371/18822
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