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Showing results 1 to 10 of 10

Issue Date	Title / Author(s) / Citation	File	Altmetrics
2021-02	Electrochemical investigation on structural components of triethylene glycol-based levelers with bromide ions for bottom-up filling in microvia 이명현	view file link
2017-12	Unravelling additive-based nanocrystal pinning for high efficiency organic-inorganic halide perovskite light-emitting diodes Park, Min-Ho; Jeong, Su-Hun; Seo, Hong-Kyu; Wolf, Christoph; Kim, Young-Hoon; Kim, Hobeom; Byun, Jinwoo; Kim, Joo Sung; Cho, Himchan; Lee, Tae-Woo Nano Energy, Vol.42, pp.157-165	DOI
2017-02	Methods to Improve Properties of Polyurethane Foam Using Liquid-Type Additives 이영범	view file
2012	Additive-Induced Morphology Control in P3HT:PCBM Bulk Heterojunction Organic Solar Cells 최원태	link
2011-05	N-(triphenylphosphoranylidene) aniline as a novel electrolyte additive for high voltage LiCoO2 operations in lithium ion batteries Lee, Je-Nam; Han, Gi-Beom; Ryou, Myung-Hyun; Lee, Dong Jin; Song, Jongchan; Choi, Jang Wook; Park, Jung-Ki Electrochimica Acta, Vol.56 No.14, pp.5195-5200	DOI
2009	화학양론적 MgAl2O4-Spinel계의 첨가제에 따른 소결특성 연구 김동현	link
2006	Cu electroless bottom-up filling techniques for ULSI interconnect fabrication 이창화
2005-05	Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochimica Acta 50 (2005) 3563–3568	DOI
2004	Characterization of Cyclosporin A-loaded poly(lactide-co-glycolide) nanospheres according to various additives and in vivo evaluation for oral administration in rats 권성학	link
2002-08	Investigation of Copper Deposition in the Presence of Benzotriazole Kim, Jae Jeong; Kim, Soo-Kil; Bae, Jong-Uk Thin Solid Films 415 (2002) 101-107	DOI

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