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Journal Papers (저널논문_전기·정보공학부)

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Issue DateTitle / Author(s) / CitationFileAltmetrics
2022-05

Park, Jungjae; Kim, Seungnyun; Moon, Jihoon; Shim, Byonghyo

2022 IEEE INTERNATIONAL CONFERENCE ON COMMUNICATIONS WORKSHOPS (ICC WORKSHOPS), pp.1153-1158

DOI
2022-05

Choi, Kangwook; Jung, Gyuweon; Hong, Seongbin; Jeong, Yujeong; Shin, Wonjun; Park, Jinwoo; Lee, Chayong; Kim, Donghee; Lee, Jong-Ho

2022 IEEE INTERNATIONAL SYMPOSIUM ON OLFACTION AND ELECTRONIC NOSE (ISOEN 2022)

DOI
2022-05

Son, Hyunwoo; Kim, Sun-Je; Hong, Jongwoo; Sung, Jangwoon; Lee, Byoungho

Scientific Reports, Vol.12 No.1, p. 8512

DOI
2022-05

Lee, Soomok; Seo, Seung-Woo

IEEE Transactions on Intelligent Transportation Systems, Vol.23 No.5, pp.4008-4020

DOI
2022-05

Chu, Yeonouk; Lee, Jaeho; Kim, Sungjoong; Kim, Hyunjoong; Yoon, Yongtae; Chung, Hyeyoung

Applied Sciences-basel, Vol.12 No.9, p. 4488

DOI
2022-05DOI
2022-05DOI
2022-05DOI
2022-05

Kim, Juhyun; Shin, Hyungcheol

IEEE Transactions on Electron Devices, Vol.69 No.5, pp.2590-2596

DOI
2022-05

Piao, Xianji; Park, Namkyoo

ACS Photonics, Vol.9 No.5, pp.1655-1662

DOI
2022-05

Kwon, Dongup; Lee, Wonsik; Kim, Dongryeong; Boo, Junehyuk; Kim, Jangwoo

ACM Transactions on Storage, Vol.18 No.2, p. 12

DOI
2022-04

Kim, Yeonwoo; Min, Kyung Kyu; Yu, Junsu; Kwon, Daewoong; Park, Byung-Gook

Semiconductor Science and Technology, Vol.37 No.4, p. 045001

DOI
2022-04

Kwon, Dongseok; Woo, Sung Yun; Lee, Jong-Ho

JOURNAL OF SEMICONDUCTOR TECHNOLOGY AND SCIENCE, Vol.22 No.2, pp.115-131

DOI
2022-04

Lee, Hunjun; Kim, Chanmyeong; Kim, Minseop; Chung, Yujin; Kim, Jangwoo

2022 IEEE INTERNATIONAL SYMPOSIUM ON HIGH-PERFORMANCE COMPUTER ARCHITECTURE (HPCA 2022), pp.633-647

DOI
2022-04

Zhang, Xuewan; Zhang, Di; Shim, Byonghyo; Han, Gangtao; Zhang, Dalong; Sato, Takuro

IEEE Internet of Things Journal, Vol.9 No.7, pp.5275-5289

DOI
2022-04DOI
2022-04DOI
2022-04

Zhang, Ruoyu; Shim, Byonghyo; Yuan, Weijie; Di Renzo, Marco; Dang, Xiaoyu; Wu, Wen

IEEE Transactions on Vehicular Technology, Vol.71 No.4, pp.4489-4494

DOI
2022-04DOI
2022-04DOI