Browse

Improved diffusion barrier by stuffing the grain boundaries of TIN with a thin A1 interlayer for Cu metallization
A1 중간층을 이용하여 TiN 결정립계를 충진한 Cu 배선공정을 위한 확산방지막에 관한 연구

Cited 0 time in Web of Science Cited 0 time in Scopus
Authors
남기태
Advisor
김기범
Issue Date
2002
Publisher
서울대학교 대학원
Description
Thesis (master`s)--서울대학교 대학원 :재료공학부,2002.
Language
English
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000061996

http://hdl.handle.net/10371/30334
Files in This Item:
There are no files associated with this item.
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Master's Degree_재료공학부)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse