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Preamorphization implantation을 이용한 CoSi₂계면향상과 접합 누설전류 감소

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Authors
임승수
Advisor
박병국
Issue Date
2001
Publisher
서울대학교 대학원
Keywords
Ticapped CoSi₂preamorphization implantation(PAI)
Description
학위논문(석사)--서울대학교 대학원 :전기.컴퓨터공학부,2001.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000065194

http://hdl.handle.net/10371/31108
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Theses (Master's Degree_전기·정보공학부)
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