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Thermal properties of acrylic emulsion pressure sensitive adhesives (PSAs) with micro-encapsulated phase change material (PCM) and application for cooling electric devices
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 김현중 | - |
| dc.contributor.author | 조윤경 | - |
| dc.date.accessioned | 2010-01-15T09:09:38Z | - |
| dc.date.available | 2010-01-15T09:09:38Z | - |
| dc.date.copyright | 2008. | - |
| dc.date.issued | 2008 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000042333 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/32922 | - |
| dc.description | Thesis(masters) --서울대학교 대학원 :산림과학부(환경재료과학전공),2008.8. | en |
| dc.format.extent | xii, 98 p. | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | 수성 아크릴 점착제 | en |
| dc.subject | water borne acrylic pressure sensitive adhesives (PSAs) | en |
| dc.subject | 네트워크 구조 | en |
| dc.subject | Network structure | en |
| dc.subject | 열적 특성 | en |
| dc.subject | Thermal property | en |
| dc.subject | PCM | en |
| dc.subject | Micro-encapsulated phase change material (PCM) | en |
| dc.subject | TIM | en |
| dc.subject | Thermal interface material (TIM) | en |
| dc.subject | Thermal PSAs | en |
| dc.subject | Thermal PSAs | en |
| dc.title | Thermal properties of acrylic emulsion pressure sensitive adhesives (PSAs) with micro-encapsulated phase change material (PCM) and application for cooling electric devices | en |
| dc.type | Thesis | - |
| dc.contributor.department | 산림과학부(환경재료과학전공) | - |
| dc.description.degree | Master | en |
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