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선형 가열법으로 접합한 실리콘 기판의 접합 특성에 관한 연구 : Study on the characteristics of Si wafer direct bonding using FLA method
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- Authors
- Advisor
- 강춘식
- Issue Date
- 1999
- Publisher
- 서울대학교 대학원
- Keywords
- 실리콘 직접 접합법 ; SDB(Silicon Direct Bonding) ; 선형가열법(FLA) ; FLA(Fast Linear Annealing) ; SOI(Silicon-On-Insulator) ; Hydrogen bond ; 수소 결합 ; Covalent bond ; 공유 결합
- Description
- 학위논문(박사)--서울대학교 대학원 :금속공학과,1999.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000074133
https://hdl.handle.net/10371/34584
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