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A study on partial melting soldering process and reliability for Pb-free flip chip package : 무연솔더 플립칩 패키지를 위한 부분용융솔더링법의 개발과 신뢰성에 관한 연구
DC Field | Value | Language |
---|---|---|
dc.contributor.advisor | 강춘식 | - |
dc.contributor.author | 하준석 | - |
dc.date.accessioned | 2010-01-17T02:12:32Z | - |
dc.date.available | 2010-01-17T02:12:32Z | - |
dc.date.copyright | 2002. | - |
dc.date.issued | 2002 | - |
dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000062865 | eng |
dc.identifier.uri | https://hdl.handle.net/10371/35411 | - |
dc.description | Thesis (doctoral)--서울대학교 대학원 :재료공학부,2002. | en |
dc.format.extent | ix, 177 leaves | en |
dc.language.iso | en | en |
dc.publisher | 서울대학교 대학원 | en |
dc.subject | partial melting soldering | en |
dc.subject | 부분용융솔더링 | en |
dc.subject | Flip Chip | en |
dc.subject | 플립칩 | en |
dc.subject | Intermetallic Compound | en |
dc.subject | 무연솔더 | en |
dc.subject | Reliability | en |
dc.subject | 금속간화합물 | en |
dc.subject | Thermal Fatigue | en |
dc.subject | 신뢰성 | en |
dc.subject | 열피로 | en |
dc.title | A study on partial melting soldering process and reliability for Pb-free flip chip package | en |
dc.title.alternative | 무연솔더 플립칩 패키지를 위한 부분용융솔더링법의 개발과 신뢰성에 관한 연구 | - |
dc.type | Thesis | - |
dc.contributor.department | 재료공학부 | - |
dc.description.degree | Doctor | en |
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