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A study on partial melting soldering process and reliability for Pb-free flip chip package : 무연솔더 플립칩 패키지를 위한 부분용융솔더링법의 개발과 신뢰성에 관한 연구

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dc.contributor.advisor강춘식-
dc.contributor.author하준석-
dc.date.accessioned2010-01-17T02:12:32Z-
dc.date.available2010-01-17T02:12:32Z-
dc.date.copyright2002.-
dc.date.issued2002-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000062865eng
dc.identifier.urihttps://hdl.handle.net/10371/35411-
dc.descriptionThesis (doctoral)--서울대학교 대학원 :재료공학부,2002.en
dc.format.extentix, 177 leavesen
dc.language.isoenen
dc.publisher서울대학교 대학원en
dc.subjectpartial melting solderingen
dc.subject부분용융솔더링en
dc.subjectFlip Chipen
dc.subject플립칩en
dc.subjectIntermetallic Compounden
dc.subject무연솔더en
dc.subjectReliabilityen
dc.subject금속간화합물en
dc.subjectThermal Fatigueen
dc.subject신뢰성en
dc.subject열피로en
dc.titleA study on partial melting soldering process and reliability for Pb-free flip chip packageen
dc.title.alternative무연솔더 플립칩 패키지를 위한 부분용융솔더링법의 개발과 신뢰성에 관한 연구-
dc.typeThesis-
dc.contributor.department재료공학부-
dc.description.degreeDoctoren
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