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A Study on fluxless soldering of Pb-free flip chip package : 무연솔더 플립칩 패키지의 무플럭스 솔더링에 관한 연구
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- Authors
- Advisor
- 강춘식
- Issue Date
- 2002
- Publisher
- 서울대학교 대학원
- Keywords
- Fild Chip ; 플립칩 ; Fluxless Soldering ; 무플럭스 솔더링 ; Pb-free Solder ; 무연남재 ; UBM ; 젖음성 ; Wettability ; 납재범프
- Description
- Thesis (doctoral)--서울대학교 대학원 :재료공학부,2002.
- Language
- English
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000060784
https://hdl.handle.net/10371/35436
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