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Investigation of CMP-induced delamination in CuUltra Low-K interconnect system by FEM stress analysis : FEM 응력 해석을 이용한 CuUltra Low-K CMP 공정에서 발생하는 박리현상에 관한 연구
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 오수익 | - |
| dc.contributor.author | 김기현 | - |
| dc.date.accessioned | 2010-01-21T09:21:35Z | - |
| dc.date.available | 2010-01-21T09:21:35Z | - |
| dc.date.copyright | 2007. | - |
| dc.date.issued | 2007 | - |
| dc.identifier.uri | http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000045110 | eng |
| dc.identifier.uri | https://hdl.handle.net/10371/41257 | - |
| dc.description | Thesis(doctor`s)--서울대학교 대학원 :기계항공공학부,2007. | en |
| dc.format.extent | xiii, 167 leaves | en |
| dc.language.iso | en | en |
| dc.publisher | 서울대학교 대학원 | en |
| dc.subject | 화학적 기계연마 | en |
| dc.subject | Chemical mechanical polishing | en |
| dc.subject | 박리 | en |
| dc.subject | Delamination | en |
| dc.subject | 초저유전물진 | en |
| dc.subject | Ultra low-K | en |
| dc.subject | 응력해석 | en |
| dc.subject | Stress analysis | en |
| dc.subject | FE 시뮬레이션 | en |
| dc.subject | FE simulation | en |
| dc.title | Investigation of CMP-induced delamination in CuUltra Low-K interconnect system by FEM stress analysis | en |
| dc.title.alternative | FEM 응력 해석을 이용한 CuUltra Low-K CMP 공정에서 발생하는 박리현상에 관한 연구 | en |
| dc.type | Thesis | - |
| dc.contributor.department | 기계항공공학부 | - |
| dc.description.degree | Doctor | en |
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