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불화탄소 플라즈마에 의한 저유전율 박막의 식각 특성 : Etch characteristics of low dielectric constant materials in fluorocarbon plasmas

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Authors

황성욱

Advisor
문상흡
Issue Date
2003
Publisher
서울대학교 대학원
Keywords
저유전율 물질Silsesquioxane불화탄소 플라즈마식각 반응 기구각도 의존성벽면 거칠기O2 RIE회분화 공정
Description
학위논문(박사)--서울대학교 대학원 :응용화학부,2003.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000058226

https://hdl.handle.net/10371/45265
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