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적층 구조의 멀티 칩 냉각을 위하여 패키지 내에 구현된 초소형 열교환기
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- Authors
- Advisor
- 전국진
- Issue Date
- 2003
- Publisher
- 서울대학교 대학원
- Description
- 학위논문(석사)--서울대학교 대학원 :전기·컴퓨터공학부,2003.
- Language
- Korean
- URI
- http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000059920
https://hdl.handle.net/10371/48357
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