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Cu 배선공정에서 확산방지막으로서 TiN 박막에 대한 연구
A Study on the TiN thin film as a diffusion barrier in Cu metallizaition

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Authors
박기철
Advisor
김기범
Issue Date
1998
Publisher
서울대학교 대학원
Keywords
TiNCu구리Al알루미늄diffusion barrier확산 방지막ion beam이온빔plasma
Description
학위논문(박사)--서울대학교 대학원 :금속공학과,1998.
Language
Korean
URI
http://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000076518

http://hdl.handle.net/10371/50832
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Material Science and Engineering (재료공학부) Theses (Ph.D. / Sc.D._재료공학부)
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