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Cu 배선공정에서 확산방지막으로서 TiN 박막에 대한 연구 : A Study on the TiN thin film as a diffusion barrier in Cu metallizaition

DC Field Value Language
dc.contributor.advisor김기범-
dc.contributor.author박기철-
dc.date.accessioned2010-02-05T06:42:19Z-
dc.date.available2010-02-05T06:42:19Z-
dc.date.copyright1998.-
dc.date.issued1998-
dc.identifier.urihttp://dcollection.snu.ac.kr:80/jsp/common/DcLoOrgPer.jsp?sItemId=000000076518kog
dc.identifier.urihttps://hdl.handle.net/10371/50832-
dc.description학위논문(박사)--서울대학교 대학원 :금속공학과,1998.ko
dc.format.extentx, 137 장ko
dc.language.isokoko
dc.publisher서울대학교 대학원ko
dc.subjectTiNko
dc.subjectCuko
dc.subject구리ko
dc.subjectAlko
dc.subject알루미늄ko
dc.subjectdiffusion barrierko
dc.subject확산 방지막ko
dc.subjection beamko
dc.subject이온빔ko
dc.subjectplasmako
dc.titleCu 배선공정에서 확산방지막으로서 TiN 박막에 대한 연구ko
dc.title.alternativeA Study on the TiN thin film as a diffusion barrier in Cu metallizaitionko
dc.typeThesis-
dc.contributor.department금속공학과-
dc.description.degreeDoctorko
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