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Interfacial Behavior of Polyimide/Primer/Copper System by Preoxidation of the Primer

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Authors
Kim, Hyuncheol; Jang, Jyongsik
Issue Date
2000
Publisher
Wiley-Blackwell
Citation
Journal of Applied Polymer Science 2000, 78, 2518–2524
Keywords
polyimide/copper systemadhesion promotioncorrosion protection
Abstract
The copolymers of vinyl imidazole (VI) and vinyl trimethoxy silane (VTS)
were applied as the corrosion inhibitors and the adhesion promoters for the polyimide/
copper system at elevated temperatures. The mol ratios of VI to VTS were 100 : 0, 70
: 30, 30 : 70, and 0 : 100. Preoxidation of the primer was performed to improve the
reactivity of the primer on poly(amic acid). A peel test was performed to evaluate the
adhesion strength of the polyimide/primer/copper systemafter heat treatment at 400°C
in a nitrogen atmosphere. The effect of the preoxidation of the primer on corrosion
protection and adhesion promotion were investigated by Fourier transform infrared
spectroscopy (FTIR), X-ray photoelectron spectroscopy (XPS), and scanning electron
microscopy (SEM). The adhesion strength of the polyimide/primer/copper system depended
on not only the chemical interaction between polyimide and the preoxidized
primer, but also the thermal stability of the primer. It showed the highest value when
the mol ratio of VI to VTS was 30 : 70. The primer layer reduced or suppressed copper
diffusion into the polyimide layer. The degree of corrosion protection by the primer was
affected by its thermal stability and its reactivity on copper.
ISSN
0021-8995
Language
English
URI
http://hdl.handle.net/10371/61957
DOI
https://doi.org/10.1002/1097-4628(20001227)78:14<2518::AID-APP120>3.0.CO;2-J
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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