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Fabrication of three-dimensional microstructures by soft molding

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Authors
Kim, Y. S.; Suh, K. Y.; Lee, Hong H.
Issue Date
2001-10-01
Publisher
American Institute of Physics
Citation
Appl. Phys. Lett. 79, 2285 (2001)
Keywords
LITHOGRAPHYPOLYMERSIMPRINT
Abstract
We have developed soft molding as a method for meso-scale-area fabrication of three-dimensional structures. The soft molding, which is a form of soft lithography, involves placing an elastomeric mold on the surface of a spin-coated polymer film with a slight pressure (<1 N/cm(2)), allowing the mold to absorb solvent, releasing the pressure, and then letting the mold and the substrate remain undisturbed for a period of time. The three-dimensional structure thus formed is robust in that the pattern fidelity is preserved without any distortion or defects. For the soft molding to be successful, the rate of solvent absorption by the mold should be larger than the rate of solvent evaporation. The method is demonstrated with several three-dimensional structures.
ISSN
0003-6951
Language
English
URI
http://hdl.handle.net/10371/6266
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Mechanical Aerospace Engineering (기계항공공학부)Journal Papers (저널논문_기계항공공학부)
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