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Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS

Cited 39 time in Web of Science Cited 41 time in Scopus
Authors
Cho, Sung Ki; Kim, Soo-Kil; Kim, Jae Jeong
Issue Date
2005-04-07
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society 152, C330-C333
Keywords
coppermetallic thin filmselectrodepositionelectrolyteselectrochemistryelectrochemical analysis
Abstract
3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic acid ~DPS! was applied as an accelerator in damascene Cu electrodeposition.
When DPS was used with a one-step electrodeposition method, it was incapable of superfilling in damascene structure.
Superfilling, however, could be accomplished with two-step electrodeposition method or derivitization method. The differences in
the Cu profiles depending on the deposition methods, were associated with the concentration-dependent behaviors of DPS. The
acceleration effect of DPS was proportional to its concentration at low concentrations below 50 mM on nonpatterned wafer, but
not at higher concentrations. Through the electrochemical analyses, the critical DPS concentration was determined at 50 mM
where the acceleration effect of DPS changed. The DPS reaction mechanism was proposed based on the concentration dependency
of the acceleration effect. This is strongly related to the change in molecular structure according to concentration. Furthermore, it
was found that even with one-step electrodeposition, the Cu filling profile was considerably improved by controlling DPS
concentration.
ISSN
0013-4651
Language
English
URI
http://hdl.handle.net/10371/65978
DOI
https://doi.org/10.1149/1.1891645
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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