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Issue DateTitle / Author(s) / CitationFileAltmetrics
2002-12
Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection

Kim, Jae Jeong; Kim, Soo-Kil; Lee, Chang Hwa; Kim, Yong Shik

The Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 21, 33-38

DOI
1