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Showing results 1 to 4 of 4

Issue Date	Title / Author(s) / Citation	File
2004-11	Superconformal Cu Electrodeposition on Various Substrates Kim, Soo-Kil; Cho, Sung Ki; Kim, Jae Jeong; Lee, Young-Soo Electrochemical and Solid-State Letters, 8(1), C19-C21	view file DOI
2005-03	Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent Lee, Chang Hwa; Kim, Jae Jeong Journal of Vacuum Science and Technology B Microelectronics and Nanometer Structures 23(2), 475-479	DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI
2011-02	(A) study on noise rejection techniques in high-speed main memory system 이재준	link