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Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS)

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Authors
Lee, Chang Hwa; Cho, Sung Ki; Kim, Jae Jeong
Issue Date
2005-09-22
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-State Letters, 8 (11) J27-J29
Abstract
Cu bottom-up filling in Cu electroless deposition was attempted using 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic
acid DPS . An accelerating effect on the planar surface was observed at low DPS concentrations, while a suppressing effect was
found at higher concentrations. Co-addition of 2,2 -dipyridyl enhanced the surface morphology. Filling profiles were dependent on
the concentration of DPS added, and Cu bottom-up filling was achieved due to a concentration gradient by diffusion of DPS
between the top and bottom of the trench.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/66126
DOI
https://doi.org/10.1149/1.206329
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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