Browse

Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing

Cited 7 time in Web of Science Cited 8 time in Scopus
Authors
Kim, Soo-Kil; Kim, Jae Jeong
Issue Date
2004-08-04
Publisher
Electrochemical Society
Citation
Electrochemical and Solid-State Letters, 7 (9), C101-C103
Keywords
copperelectrodepositionprintingorganic compoundsmonolayersintegrated circuit interconnections
Abstract
To avoid complications brought about by employing organic additives, microcontact printing using a flat stamp was used in
forming trench-selective Cu superfilling on damascene structure. Self-assembled monolayers of 1-decanethiol transferred on top
surface of the trench could withstand the H2SO4 electrolyte and were used as a barrier for current transfer below a certain potential
that was not yet dominated by the tunneling current. Subsequent electrodeposition on the printing area was successfully inhibited.
The resulting filling profile was a defect-free superfilling with bumps on top. This is comparable to the three-additive system
consisting of accelerator and two-component suppressor.
ISSN
1099-0062
Language
English
URI
http://hdl.handle.net/10371/66131
DOI
https://doi.org/10.1149/1.1778932
Files in This Item:
Appears in Collections:
College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
  • mendeley

Items in S-Space are protected by copyright, with all rights reserved, unless otherwise indicated.

Browse