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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2002-12	Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer Kim, Jae Jeong; Kim, Yong Shik; Kim, Soo-Kil Electrochemical and Solid-State Letters, 6 (2), C17-C20	view file DOI
2004-08	Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 7 (9), C101-C103	view file DOI