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Leveling with Step Potential in Damascene Cu Electrodeposition
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- Authors
- Issue Date
- 2006-09-09
- Publisher
- Electrochemical Society
- Citation
- Journal of The Electrochemical Society, 153(12), C822-C825
- Abstract
- Organic leveler-free leveling, issued in damascene Cu electrodeposition for uniform Cu patterning by the chemical mechanical
polishing process, was investigated using a potentiostatic step function. A perfectly leveled Cu surface was obtained with applying
a positive step potential. The distribution of locally adsorbed bis 3–sulfopropyl disulfide SPS , which was the main cause of the
formation of topographic variation on the wafer surface, was modified by the use of a positive step potential. The redistribution of
adsorbed SPS was a result of desorption of SPS through the dissolution occurring during the step time. Desorbed SPS was then
readsorbed uniformly on the Cu surface after a step time, resulting in a flat Cu surface. Electrochemical linear sweep voltammetry
and chronoamperometry analyses revealed a decrease in current, which meant the desorption of SPS on Cu surface was caused by
the dissolution of Cu. By varying the step potential and step time, it was confirmed that at least 6 nm of the Cu layer should be
dissolved for effective desorption of SPS and successful leveling.
- ISSN
- 0013-4651
- Language
- English
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