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Silver Direct Electrodeposition on Ru Thin Films

Cited 6 time in Web of Science Cited 8 time in Scopus
Authors
Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong
Issue Date
2008-03-20
Publisher
Electrochemical Society
Citation
Journal of The Electrochemical Society, 155(5), D389-D394
Abstract
Electrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction
in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was
important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the
application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better
substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed
initial population of Ag particles, and as a result a smooth film was obtained.
ISSN
0013-4651
Language
English
URI
http://hdl.handle.net/10371/68290
DOI
https://doi.org/10.1149/1.2890394
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Chemical and Biological Engineering (화학생물공학부)Journal Papers (저널논문_화학생물공학부)
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