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Silver Direct Electrodeposition on Ru Thin Films

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dc.contributor.authorKoo, Hyo-Chol-
dc.contributor.authorCho, Sung Ki-
dc.contributor.authorLee, Chang Hwa-
dc.contributor.authorKim, Soo-Kil-
dc.contributor.authorKwon, Oh Joong-
dc.contributor.authorKim, Jae Jeong-
dc.date.accessioned2010-07-05T06:04:15Z-
dc.date.available2010-07-05T06:04:15Z-
dc.date.issued2008-03-20-
dc.identifier.citationJournal of The Electrochemical Society, 155(5), D389-D394en
dc.identifier.issn0013-4651-
dc.identifier.urihttps://hdl.handle.net/10371/68290-
dc.description.abstractElectrodeposition of Ag was performed on Ru thin films following electrochemical reduction of native Ru oxide. Oxide reduction
in a tetramethylammonium hydroxide solution was critical for the formation of continuous Ag film, and a large overpotential was
important for high-density nucleation. From a kinetics viewpoint, the thermal stability of the Ag film was improved by the
application of a more negative potential, which suggested that better nucleation density at the initial stage of growth induced better
substrate adhesion. Suppression of growth by addition of an organic additive generated a larger and more uniformly distributed
initial population of Ag particles, and as a result a smooth film was obtained.
en
dc.description.sponsorshipThis work was supported by KOSEF through the Research Center
for Energy Conversion and Storage (RCECS), the Institute of
Chemical Processing (ICP) in Seoul National University, and
Dongbu HiTek.
en
dc.language.isoenen
dc.publisherElectrochemical Societyen
dc.titleSilver Direct Electrodeposition on Ru Thin Filmsen
dc.typeArticleen
dc.contributor.AlternativeAuthor구효철-
dc.contributor.AlternativeAuthor조성기-
dc.contributor.AlternativeAuthor이창화-
dc.contributor.AlternativeAuthor김수길-
dc.contributor.AlternativeAuthor권오중-
dc.contributor.AlternativeAuthor김재정-
dc.identifier.doi10.1149/1.2890394-
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