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Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition
Cited 21 time in
Web of Science
Cited 22 time in Scopus
- Authors
- Issue Date
- 2009-04-21
- Publisher
- Electrochemical Society
- Citation
- Journal of The Electrochemical Society, 156(6), D207-D210
- Abstract
- Superconformal Cu electroless deposition is demonstrated in a CuSO4–EDTA–HCHO (where EDTA is ethylenediaminetetraacetic
acid) electrolyte containing 2-mercapto-5-benzimidazolesulfonic acid (MBIS). MBIS reveals a concentration-dependent effect in
the deposition rate on planar substrates, whereby acceleration at low concentration and suppression at high concentration are
evident. The half-cell reaction experiments show that the acceleration effect of MBIS is mainly associated with the cathodic
reaction, while MBIS inhibits the oxidation of HCHO in the anodic reaction. The addition of MBIS offers preferential Cu
electroless deposition at the bottom of 500 nm wide trenches. Poly(ethylene glycol) improved the surface roughness, maintaining
the shape evolution of superconformal feature filling.
- ISSN
- 0013-4651
- Language
- English
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