S-Space College of Engineering/Engineering Practice School (공과대학/대학원) Dept. of Chemical and Biological Engineering (화학생물공학부) Journal Papers (저널논문_화학생물공학부)
The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation
- Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong
- Issue Date
- Thin Solid Films 516 (2008) 3761–3766
- The effect of thiourea on copper deposition onto a copper seed layer from an electrolyte composed of CuSO4, H2SO4, deionized water, and
thiourea was investigated. Even in the presence of very low concentrations of thiourea, extremely smooth and bright copper deposits were
obtained. From the results of X-ray photoelectron spectroscopy, Auger electron spectroscopy, and electrochemical analyses, thiourea was found to
react with copper or copper ions leading to the generation of CuS. CuS adsorption onto the copper seed layer seemed to inhibit the initial
nucleation of the copper adions, resulting in the formation of smaller Cu grains compared to those forming in the absence of thiourea. CuS was
observed to cover all active sites of the 1 cm2 copper seed layer above 0.017 g/L thiourea. The surface roughness as well as the mean grain size of
the deposits also approached minimum values above this thiourea concentration. Adsorbed CuS was incorporated into the deposits during
electroplating, which was believed to be the major factor for the increased resistivity of the deposits.
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