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A High-Yield Fabrication Process for Silicon Neural Probes
Cited 10 time in
Web of Science
Cited 11 time in Scopus
- Authors
- Issue Date
- 2006-02
- Citation
- IEEE Trans. Biomed. Eng., vol. 53, pp. 351-354, Feb. 2006
- Keywords
- High-yield process ; neural prosthesis ; sidewall protection ; silicon neural probe ; wet etching
- Abstract
- There is a great need for silicon microelectrodes that can simultaneously
monitor the activity of many neurons in the brain. However,
one of the existing processes for fabricating silicon microelectrodes—reactive-
ion etching in combination with anisotropic KOH etching—breaks
down at the wet-etching step for device release. Here we describe amodified
wet-etching sidewall-protection technique for the high-yield fabrication of
well-defined silicon probe structures, using a Teflon® shield and low-pressure
chemical vapor deposition (LPCVD) silicon nitride. In the proposed
method, a micro-tab holds each individual probe to the central scaffold, allowing
uniform anisotropicKOHetching. Using this approach, we obtained
a well-defined probe structure without device loss during the wet-etching
process. This simple method yielded more accurate fabrication and an improved
mechanical profile.
- ISSN
- 0018-9294
- Language
- English
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