SHERP

A High-Yield Fabrication Process for Silicon Neural Probes

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Authors
Oh, Seung Jae; Song, Jong Keun; Kim, Jin Won; Kim, Sung June
Issue Date
2006-02
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Citation
IEEE Trans. Biomed. Eng., vol. 53, pp. 351-354, Feb. 2006
Keywords
High-yield processneural prosthesissidewall protectionsilicon neural probewet etching
Abstract
There is a great need for silicon microelectrodes that can simultaneously
monitor the activity of many neurons in the brain. However,
one of the existing processes for fabricating silicon microelectrodes—reactive-
ion etching in combination with anisotropic KOH etching—breaks
down at the wet-etching step for device release. Here we describe amodified
wet-etching sidewall-protection technique for the high-yield fabrication of
well-defined silicon probe structures, using a Teflon® shield and low-pressure
chemical vapor deposition (LPCVD) silicon nitride. In the proposed
method, a micro-tab holds each individual probe to the central scaffold, allowing
uniform anisotropicKOHetching. Using this approach, we obtained
a well-defined probe structure without device loss during the wet-etching
process. This simple method yielded more accurate fabrication and an improved
mechanical profile.
ISSN
0018-9294
Language
English
URI
http://hdl.handle.net/10371/8863
DOI
https://doi.org/10.1109/TBME.2005.862568
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Journal Papers (저널논문_전기·정보공학부)
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