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A Micromachined Silicon Depth Probe for Multichannel Neural Recording
DC Field | Value | Language |
---|---|---|
dc.contributor.author | Yoon, Tae Hwan | - |
dc.contributor.author | Hwang, Eun Jung | - |
dc.contributor.author | Shin, Dong Yong | - |
dc.contributor.author | Park, Se Ik | - |
dc.contributor.author | Oh, Seung Jae | - |
dc.contributor.author | Jung, Sung Cherl | - |
dc.contributor.author | Shin, Hyung Cheul | - |
dc.contributor.author | Kim, Sung June | - |
dc.date.accessioned | 2009-09-07T23:29:37Z | - |
dc.date.available | 2009-09-07T23:29:37Z | - |
dc.date.issued | 2000-08 | - |
dc.identifier.citation | IEEE Trans. Biomed. Eng., vol. 47, pp. 1082-1087, Aug. 2000 | en |
dc.identifier.issn | 0018-9294 | - |
dc.identifier.uri | https://hdl.handle.net/10371/8867 | - |
dc.description.abstract | Aprocess of making a new type of silicon depth-probe
microelectrode array is described using a combination of plasma and wet etch. The plasma etch, which is done using a low temperature oxide (LTO) mask, enables probe thickness to be controlled over a range from 5 to 90 . Bending tests show that the probes mechanical strength depends largely on shank thickness. More force can be applied to thicker shanks while thinner shanks are more flexible. One can then choose a thickness and corresponding mechanical strength using the process developed. The entire probe shaping process is performed only at low temperature, and thus is consistent with the standard CMOS fabrication. Using the probe in recording from rats somatosensory cortex, we obtained four channel simultaneous recordings which showed clear independence among channels with a signal-to-noise ratio performance comparable with that obtained using other devices. | en |
dc.description.sponsorship | This paper was
supported by the Nano Bioelectronics & System Center, Basic Research program of Korea Science and Engineering Foundation (KOSEF) under Grant 971- 0913-076-2, by the Korea Research Foundation (NDRF) under Grant 1996-012- E0529, by Ministry Health andWelfare, Korea under Grant HMP-98-E-1-0006, by the Korea Electronic Technology Institute (KETI) MEMS, and by the Research Products Sharing Program of Inter-university Semiconductor Research Center (ISRC) at Seoul National University. | en |
dc.language.iso | en | - |
dc.publisher | Institute of Electrical and Electronics Engineers (IEEE) | en |
dc.subject | Mechanical stress test | en |
dc.subject | multichannel simultaneous recording | en |
dc.subject | neural probes | en |
dc.subject | plasma etch | en |
dc.subject | silicon microelectrode array | en |
dc.title | A Micromachined Silicon Depth Probe for Multichannel Neural Recording | en |
dc.type | Article | en |
dc.contributor.AlternativeAuthor | 윤태환 | - |
dc.contributor.AlternativeAuthor | 황은정 | - |
dc.contributor.AlternativeAuthor | 신동용 | - |
dc.contributor.AlternativeAuthor | 박세익 | - |
dc.contributor.AlternativeAuthor | 오승재 | - |
dc.contributor.AlternativeAuthor | 정성철 | - |
dc.contributor.AlternativeAuthor | 신형철 | - |
dc.contributor.AlternativeAuthor | 김성준 | - |
dc.identifier.doi | 10.1109/10.855936 | - |
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