Laser-Induced Fabrication of a Transsubstrate Microelectrode Array and Its Neurophysiological Performance

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Kim, Sung June; Kim, Myunghwan; Heetderks, William J.
Issue Date
Institute of Electrical and Electronics Engineers (IEEE)
IEEE Trans. Biomed. Eng., vol. BME-32, pp. 497-502, July 1985
Technical problems associated with the monolithic integration
of active circuitry into a high-density microelectrode array for
neural recordings include passivation of the active circuit area, capacitive
coupling of switching transients, and nonuniformity of the recording
surface. These problems can be eliminated by implementing
the passive and active elements on opposite planes of a substrate and
interconnecting them with transsubstrate conductive channels.
As the first step toward this integrated active transsubstrate microelectrode
array (TMEA), a passive TMEA was fabricated and is reported
in this paper. An array of six transsubstrate conductive channels,
each 100 /tm in diameter and spaced on 100 Am centers, were
made in a 7 mil thick silicon substrate using a laser-induced diffusion
technique. The transsubstrate channels are metal doped p-type channels
embedded in a n-type silicon wafer. The p-n junction thus formed
provides good channel-to-substrate and channel-to-channel isolation.
Excellent recordings were made from crayfish giant axons using
TMEA. The signal-to-noise ratio was as large as 10 to 1 with no crosstalk
observed between adjacent channels. The TMEA showed no degradation
with long-term use.
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College of Engineering/Engineering Practice School (공과대학/대학원)Dept. of Electrical and Computer Engineering (전기·정보공학부)Journal Papers (저널논문_전기·정보공학부)
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