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On the role of surface tensions and process conditions in detachment nanolithography

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dc.contributor.authorKim, Jae Kwan-
dc.contributor.authorSuh, Kahp Y.-
dc.date.accessioned2009-09-08T06:44:23Z-
dc.date.available2009-09-08T06:44:23Z-
dc.date.issued2008-06-02-
dc.identifier.citationAppl. Phys. Lett. 92, 223107 (2008)en
dc.identifier.issn0003-6951-
dc.identifier.urihttps://hdl.handle.net/10371/8974-
dc.description.abstractWe report on the role of intrinsic (adhesion force and wettability) and extrinsic (temperature and pressure) conditions to fabricate dense nanoscale patterns in detachment nanolithography. A phase diagram is constructed by using a rigiflex polymeric mold, an organic film, and silicon or gold substrate. Operating conditions in terms of surface tensions and processing parameters are discussed along with comparison of the minimum resolution with a simple theory.en
dc.description.sponsorshipThis work was supported by the Micro Thermal System Research Center of Seoul National University and in part by the Ministry of Science and Technolog through the Nanoscopia Center of Excellence.en
dc.language.isoen-
dc.publisherAmerican Institute of Physicsen
dc.subjectLITHOGRAPHYen
dc.subjectSTAMPen
dc.subjectSOFTen
dc.titleOn the role of surface tensions and process conditions in detachment nanolithographyen
dc.typeArticleen
dc.contributor.AlternativeAuthor김재관-
dc.contributor.AlternativeAuthor서갑양-
dc.identifier.doi10.1063/1.2937143-
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