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Issue Date	Title / Author(s) / Citation	File	Altmetrics
2005-05	Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochimica Acta 50 (2005) 3563–3568	DOI
2005-06	Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS) Lee, Chang Hwa; Lee, Sang Chul; Kim, Jae Jeong Electrochemical and Solid-State Letters, 8 (8), C110-C113	view file DOI