Author
Showing results 1 to 18 of 18
Issue Date | Title / Author(s) / Citation | File | Altmetrics |
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2000-08 | IEEE Trans. Biomed. Eng., vol. 47, pp. 1082-1087, Aug. 2000 | view fileDOI | |
2003-01 | J. Mater. Sci. Lett. 22(2) (2003) 131 | DOI | |
2003-08 | Biotechnol. Bioprocess Eng. 8: 252-256 | DOI | |
2003-08 | World Congress on Medical Physics and Biomedical Engineering, Sydney, Australia, August 24-29, 2003 | view file | |
2003-10 | 6th Seoul National Univ. and Hokkaido Univ. Joint Symposium, Seoul, Korea, October 17, 2003 | view file | |
2003-10 | NIH 34th Neural workshop, Bethesda MD, USA, October 21-23, 2003 | view file | |
2003-10 | 2ne KAIST International Symposium on Frontier Issues in Nano-Bio-Information Technologies, Daejeon, Korea, October 27, 2003 | view file | |
2003-11 | 2003 Society for Neuroscience Meeting, New Orleans, LA., USA, November 8-12, 2003 | view file | |
2004-01 | Mater. Sci. Eng., C 24 (2004) 265-268 | DOI | |
2004-02 | The IASTED International Conference on Biomedical Engineering (BioMed 2004), Innsbruck, Austria, February 16-18, 2004 | view file | |
2004-05 | The 43rd Annual Conference (MBE2004) of The Japanese Society for Medical and Biological Engineering(JSMBE), Kanazawa, Japan, May 19-21, 2004 | view file | |
2004-11 | Neural Interfaces Workshop, Bethesda, Maryland, November 15-17, 2004 | view file | |
2004-11 | Neural Interfaces Workshop, Bethesda, Maryland, November 15-17, 2004 | view file | |
2005-10 | 9th International Conference on Miniaturized Systems for Chemistry and Life Science, pp.1177-1179, Boston, Massachusetts, USA, October 9-13, 2005 | view file | |
2006-02 | IEEE Trans. Biomed. Eng., vol. 53, pp. 351-354, Feb. 2006 | view fileDOI | |
2006-07 | 5th International Meeting on Substrate-Integrated Micro Electrode Arrays (MEA Meeting 2006), Reutlingen, Germany, July 4-7, 2006 | view file | |
2006-07 | 5th International Meeting on Substrate-Integrated Micro Electrode Arrays (MEA Meeting 2006), Reutlingen, Germany, July 4-7, 2006 | view file | |
2006-09 | J. Neural. Eng. 3 196-207 | DOI |