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Showing results 61 to 120 of 131

Issue Date	Title / Author(s) / Citation	File
2007	H2O-controlled synthesis of TiO2 with nanosized channel structure through in situ esterification and its application to photocatalytic oxidation Oh, Song-Taek; Choi, Jae-Suk; Lee, Han-Su; Lu, Lianhai; Kwon, Heock-Hoi; Song, In Kyu; Kim, Jae Jeong; Lee, Ho-In Journal of Molecular Catalysis A: Chemical 267 (2007) 112–119	DOI
2007-01	Method of catalyst coating in micro-reactors for methanol steam reforming Hwang, Sun-Mi; Kwon, Oh Joong; Kim, Jae Jeong Applied Catalyst A 316 (2007) 83–89	DOI
2007-02	Optimization of a Pretreatment for Copper Electroless Deposition on Ta Substrates Lee, Chang Hwa; Cha, Seung Hwan; Kim, Ae Rim; Hong, Ji-Ho; Kim, Jae Jeong Journal of the Electrochemical Society, 154(3), D182-D187	view file DOI
2007-02	Performance of a Miniaturized Silicon Reformer-PrOx-Fuel Cell System Kwon, Oh Joong; Hwang, Sun-Mi; Chae, Je Hyun; Kang, Moo Seong; Kim, Jae Jeong Journal of Power Sources 165 (2007) 342–346	DOI
2007-04	H2O-controlled synthesis of TiO2 with nanosized channel structure through in situ esterification and its application to photocatalytic oxidation Oh, Song-Taek; Choi, Jae-Suk; Lee, Han-Su; Lu, Lianhai; Kwon, Heock-Hoi; Song, In Kyu; Kim, Jae Jeong; Lee, Ho-In Journal of Molecular Catalysis A: Chemical 267 (2007) 112–119	DOI
2007-08	Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects Cho, Sung-Ki; Lee, Jong Kyun; Kim, Soo-Kil; Kim, Jae Jeong Electrochemical and Solid-State Letters, 10(10), D116-D119	view file DOI
2007-09	A Silicon-Based Miniaturized Reformer for High Power Electric Devices Kwon, Oh Joong; Hwang, Sun-Mi; Song, In Kyu; Lee, Ho-In; Kim, Jae Jeong Chemical Engineering Journal 133 (2007) 157–163	DOI
2007-11	Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid Lee, Chang Hwa; Kim, Ae Rim; Kim, Soo-Kil; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid-state Letters, 11(1), D18-D21	view file DOI
2008	차세대 인쇄회로기판 배선용 관통 비아에서 구리 전해 도금 시 첨가제의 영향 연구 권기욱	link
2008	(The)Redox reaction in Cu oxide formation and the in-situ formation of capping layer in Cu CMP 강민철	link
2008	실리콘 기반 소형 고분자 전해질 막 연료전지의 제작 및 작동 조건 최적화를 위한 임피던스 분석법의 적용 채제현	link
2008	Study on the initial steps in Ag electroless and electrodeposition 구효철	link
2008	Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel–alumina xerogel catalysts: Effect of nickel content Seo, Jeong Gil; Youn, Min Hye; Lee, Ho-In; Kim, Jae Jeong; Yang, Eunsun; Chung, Jin Suk; Kim, Pil; Song, In Kyu Chemical Engineering Journal 141 (2008) 298–304	DOI
2008-01	Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 155(3), D176-D180	view file DOI
2008-02	Large-scale synthesis of water dispersible ceria nanocrystals by a simple sol-gel process and their use as a chemical mechanical planarization slurry Yu, Taekyung; Park, Yong Il; Kang, Min-Cheol; Joo, Jin; Park, Jin Kyung; Won, Ho Youn; Kim, Jae Jeong; Hyeon, Taeghwan European Journal of Inorganic Chemistry No.6, pp.855-858	DOI
2008-03	Silver Direct Electrodeposition on Ru Thin Films Koo, Hyo-Chol; Cho, Sung Ki; Lee, Chang Hwa; Kim, Soo-Kil; Kwon, Oh Joong; Kim, Jae Jeong Journal of The Electrochemical Society, 155(5), D389-D394	view file DOI
2008-04	The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation Kang, Moo Seong; Kim, Soo-Kil; Kim, Keeho; Kim, Jae Jeong Thin Solid Films 516 (2008) 3761–3766	DOI
2008-07	Silicon-based miniaturized reformer with methanol catalytic burner Kwon, Oh Joong; Yoon, Duk Hyoung; Kim, Jae Jeong Chemical Engineering Journal, 140 (2008) 466–472	DOI
2008-07	Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection Koo, Hyo-Chol; Kim, Seo Young; Cho, Sung Ki; Kim, Jae Jeong Journal of The Electrochemical Society, 155(9), D558-D562	view file DOI
2009	구리 무전해 도금을 위한 표면 전처리 및 전기화학분석법을 통한 모니터링 임태호	link
2009	Superfilling and leveling in damascene Cu electrodeposition for high performance semiconductor devices 조성기	link
2009	Preparation of Ptshell-Pdcore Nanoparticle with Electroless Deposition of Copper and the Application for Polymer Electrolyte Membrane Fuel Cell 최인수	link
2009-01	Silicon-based micro-reactor for preferential CO oxidation Hwang, Sun-Mi; Kwon, Oh Joong; Ahn, Sang Hyun; Kim, Jae Jeong Chemical Engineering Journal 146 (2009) 105–111	DOI
2009-02	A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization Cho, Sung Ki; Lim, Taeho; Lee, Hong-Kee; Kim, Jae Jeong Journal of The Electrochemical Society, 157(4), D187-D192	view file DOI
2009-04	Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition Lee, Chang Hwa; Kim, Ae Rim; Koo, Hyo-Chol; Kim, Jae Jeong Journal of The Electrochemical Society, 156(6), D207-D210	view file DOI
2009-05	Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process Koo, Hyo-Chol; Cho, Sung Ki; Kwon, Oh Joong; Suh, Myung-Won; Im, Young; Kim, Jae Jeong Journal of The Electrochemical Society, 156(7), D236-D241	view file DOI
2009-05	Characterization and Cu Electroless Plating of Laser-drilled Through-Wafer via-holes in GaN/Al2O3 Ahn, Jaehui; Kim, Hong-Yeol; Koo, Hyo-chol; Kim, Jae Jeong; Kim, Jihyun Thin Solid Films 517 (2009) 3841 - 3843	DOI
2009-07	In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(9), H340-H343	view file DOI
2009-10	Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing Kang, Min Cheol; Kim, Yung Jun; Koo, Hyo-Chol; Cho, Sung Ki; Kim, Jae Jeong Electrochemical and Solid state Letters, 12(12), H433-H436	view file DOI
2009-11	Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications Ko, Jung Woo; Koo, Hyo Chol; Kim, Dong Wan; Seo, Sung Min; Kang, Tae June; Kwon, Yongjoo; Yoon, Jung Lim; Cheon, Jun Ho; Kim, Yong Hyup; Kim, Jae Jeong; Park, Young June Journal of The Electrochemical Society, 157(1), D46-D49	view file DOI
2010	중성 영역 구리 화학적 기계적 평탄화 공정에서의 선형 착물형성제의 특성 및 구연산과 ATRA 기반의 세정액 연구 배재한	link
2010	은 전해도금에서 시안화 도금액 특성 및 유기 첨가제 영향 연구 김영욱	link
2011-02	구리 화학적 기계적 평탄화 공정에서 유기산 세정액의 영향성 연구 조범구	link
2011-02	Effects of the functional groups of complexing agent and Cu Oxide formation on the Cu CMP slurry performance 김영준	link
2011-08	Evaluation of Pt-Ni-Pd catalysts for oxygen reduction reaction and Pt-Pb catalysts for formic acid oxidation 황선미	link
2012	TAD 세정액이 Cu CMP 공정 후에 미치는 영향 김승욱	link
2012-02	피로인산 전해질 속에서 전해 도금을 이용한 씨앗층 수리 최승회	link
2012-02	Study on Electrochemical Preparation of Pt-based Catalyst for Direct Methanol Fuel Cell Anode 안상현	link
2013-02	The influences of pulse and pulse-reverse electrodeposition on the properties of Cu thin films and superfilling for the fabrication of Cu interconnection 김명준	view file
2013-02	Fabrication of Pt-Based Electro-Catalyst for Polymer Electrolyte Membrane Fuel Cell 최인수	view file
2013-02	Investigation of Cu electroless deposition mechanism using OCP measurement with QCM for the application to Cu damascene process in semiconductor fabrication 임태호	view file
2013-08	in-situ Transmittance Evaluation of Solutions for Cu Electroless Deposition and Its Applications 박경주	view file
2013-08	리튬이온 이차전지에서 MEMS 공정을 이용하여 제작한 실리콘 음극의 특성연구 이민정	view file
2014-02	마이크로비아 필링을 위한 구리 전해 도금에 적용되는 유기 첨가제의 영향 연구 서혁진	view file
2014-02	중성 영역 구리 화학적 기계적 평탄화 공정에서의 작용기에 따른 부식방지제의 영향성 연구 이상원	view file
2014-02	Effect of Fluoroethylene Carbonate on the Electrochemical Battery Performance and Surface Film Formation Mechanism of Amorphous MoO2 Lithium-Ion Secondary Battery Negative Electrodes Jongwoo Park	view file
2015-02	실시간 모니터링을 통한 구리 무전해 도금에서의 SPS의 영향 확인 및 메커니즘 규명 민윤지	view file
2016-02	Direct Cu deposition on Ru and Co/Ni alloy barrier layer for the next-generation Cu damascene process 김광환	view file
2016-02	Decomposition of Bis(3-Sulfopropyl) Disulfide and Poly(Ethylene Glycol-Propylene Glycol) during Cu Electrodeposition and Its Monitoring via Electrochemical Method 최승회	view file
2016-02	Quercetin 천가제에 의한 리튬 이온 이차전지용 LiNi0.5Mn1.5O4 양극의 고온 사이클 수명 향상 연구 김성경	view file
2017-02	Superfilling of Through-Silicon-Vias by Cu Electrodeposition with Iodide-based Levelers and Improvement of Filling Efficiency by Adding Thiourea 김회철	view file
2017-02	구리 전해도금에서 가속제로서 작용하는 bis(3-sulfopropyl) disulfide 와 3-mercapto-1-1propanesulfonic acid의 메커니즘에 대한 열역학적 고찰 신혜자	view file
2017-02	Facile synthesis of Ni-Cu phosphorous as an efficient water oxidation electrocatalyst via electrodeposition 김병근	view file
2017-08	Structural Refinement Using Nanowire and Micro-patterned Substrate for Si- or Sn-based Li-alloying Material in Li-ion Batteries 김명호	view file
2018-02	다공성 슬러리 연마재를 이용한 화학적 기계적 평탄화 공정 능력 향상 및 응용 김욱환	view file
2018-08	Control of Biofouling in Membrane Bioreactor for Wastewater Treatment by Quorum-Quenching Bacteria Immobilized in Moving Beads 김상룡	view file
2019-02	메모리 반도체 세정 공정을 위한 코발트 산화 및 용해에 미치는 착화제의 영향 분석 권오성	view file
2019-02	Fabrication of Ag catalysts using electrodeposition and its application for electrochemical reduction of carbon dioxide 함유석	view file
2019-08	Synthesis of Pd-Cu catalyst with modified composition and structure via galvanic displacement and its electrochemical applications 백승연	view file link
2020	Study on the reverse selective CMP on silicon based materials and post CMP Co surface for the contact formation in next generation Flash NAND Device 배기호	view file link

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