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Manipulation of nanocracks on silicon based thin film and its application as large area nanopatterning

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dc.contributor.advisor고승환-
dc.contributor.author서영덕-
dc.date.accessioned2017-07-13T06:24:23Z-
dc.date.available2017-07-13T06:24:23Z-
dc.date.issued2016-02-
dc.identifier.other000000133117-
dc.identifier.urihttps://hdl.handle.net/10371/118524-
dc.description학위논문 (박사)-- 서울대학교 대학원 : 기계항공공학부, 2016. 2. 고승환.-
dc.description.abstractGenerally, a fracture is considered as an uncontrollable phenomenon due to its highly random nature. The aim of this study is to investigate straight, random, and highly ordered cracks such as oscillatory cracks and to manipulate via elaborate control of mechanical properties of the cracking medium including thickness, geometry, and elastic mismatch. Utilizing semiconductor fabrication and laser technology, a specific thin film with micro-sized notches fabricated on a silicon based substrate generates various types of self-propagating nano-cracks in large area including optical wave-like nano-cracks resembling refraction, total internal reflection and evanescent wave. These novel properties are utilized to fabricate complex and large areal nano/micro patterns which is extremely difficult to fabricate using conventional nano/micro patterning process. The nano/micro patterns made in this study are directly implementable into a nano/micro-channel application since the cracks naturally have a form of channel-like shape. In addition, a flexible transparent conductor fabrication using the nano/micro patterns as template is demonstrated.-
dc.description.tableofcontentsChapter 1. Introduction 1
1.1 Background 1
1.2 Previous studies 4
1.3 Objective 7

Chapter 2. Generation and manipulation of nanocracks 8
2.1 Thin film cracking by residual stress of Si3N4 on Silicon substrate 8
2.2 Crack initiation and stop control 12
2.3 Types of cracks 15
2.4 Crack manipulation 18
2.5 Complex nanopattern fabrication by crack manipulation 31
2.6 In-sit patterning using laser indentation process 36

Chapter 3. Applications using crack manipulation 46
3.1 Nano/micro channel fabrication 46
3.2 Transparent conductor fabrication using crack manipulation 51
3.2.1 Necessity of flexible transparent conductor 51
3.2.2 Current transparent conductors 53
3.2.3 Objectives for transparent conductor fabrication using cracking of thin film 55
3.2.4 Transparent conductor fabrication using cracking of thin film 56
3.2.5 Master template fabrication and NW transfer to transparent film 60
3.2.6 Control of pattern density using random cracking 62
3.2.7 Optical, electrical and mechanical properties of the transparent conductor 64
3.2.8 Transparent conductor fabrication using random crack filled with copper nanoparticles followed by laser sintering process 68
3.2.9 Optical electrical and mechanical properties of the copper based transparent conductor 73

Chapter 4. Summary and future work 76
4.1 Summary 76
4.2 Future work 78

Reference 79

Abstract 83
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dc.formatapplication/pdf-
dc.format.extent4360470 bytes-
dc.format.mediumapplication/pdf-
dc.language.isoen-
dc.publisher서울대학교 대학원-
dc.subjectNanopatterning-
dc.subjectfracture-
dc.subjectcrack-
dc.subjecttransparent conductor-
dc.subjectcrack assisted patterning-
dc.subject.ddc621-
dc.titleManipulation of nanocracks on silicon based thin film and its application as large area nanopatterning-
dc.typeThesis-
dc.description.degreeDoctor-
dc.citation.pages90-
dc.contributor.affiliation공과대학 기계항공공학부-
dc.date.awarded2016-02-
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